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现在对半导体器件的可靠性要求越来越高,因此对器件的质量检测提出了严格的要求,为了能准确检测器件质量是否合格,使用X射线检测技术对器件进行无损检测。X射线对缺陷损伤做快速精确探测分析具有方便、直观等优点。对一例不常见的X射线照相检查发现的晶体管空洞缺陷进行了分析、试验,确定空洞是由管壳存在的问题引起的,提出了解决空洞问题的措施。说明了器件在筛选时进行X射线照相检查的必要性,可以将有缺陷的器件早期剔除,以保证器件的可靠性。
Now the reliability requirements of semiconductor devices are getting higher and higher, so the quality of the device testing made stringent requirements, in order to accurately test the quality of the device is qualified, the use of X-ray detection technology for non-destructive testing of the device. X-ray detection of defect damage done quickly and accurately with convenient, intuitive and so on. An unusual case of X-ray photolithography was analyzed and tested to determine whether the cavity was caused by the existence of the shell. The measures to solve the problem of cavity were put forward. Explain the need for X-ray inspection of the device during screening, and eliminate defective components early enough to ensure device reliability.