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概述了IST作为对印制电路板过孔和互连可靠性的一种测试手段的发展历史,测试条件和数据分析方法,展望了其今后的研究方向。
The development history, test conditions and data analysis methods of IST, as a test method of PCB vias and interconnection reliability, are summarized. Its future research directions are also discussed.