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当今开发的成像用多元热探测器,在微小的间距上都有大量的像素点。这种多元探测器图像衰减的主要原因,是热电陶瓷晶片的侧向热扩散。而多元传感阵列是附着在该晶片之上的。本文论述了采用离子束刻蚀技术实现晶片中相邻元件之间的热隔离的方法.从而大幅度地改善了多元探测器阵列的调制传递函数。同时还涉及到绳膜技术、刻蚀率及图案转换特性等内容。关于离子束刻蚀条件对化学成分和热电陶瓷表面电阻率的影响,本文从应用方面作了描述并进行了讨论。文中对采用大直径离子束刻蚀较薄热电陶瓷晶片,同时保证表面损伤最小的方法,也作了简要介绍。
Today’s imaging multi-element heat detectors have a large number of pixels at small distances. The main reason for this multivariate detector image attenuation is the lateral thermal diffusion of the thermoelectric ceramic wafer. Multiple sensing arrays are attached to the die. This article discusses the method of ion beam etching for thermal isolation between adjacent components in a wafer, thereby greatly improving the modulation transfer function of a multivariate detector array. Also involved in rope technology, etching rate and pattern conversion features and so on. On the ion beam etching conditions on the chemical composition and the surface resistivity of the thermoelectric ceramic, the application has been described and discussed. In this paper, the use of large diameter ion beam etching thinner thermoelectric ceramic wafer, while ensuring the minimum surface damage methods, but also made a brief introduction.