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面向21世纪的高度信息化社会,电子机械的发展日新月异,手机及各种自动机械的轻薄短小化和普及发展加速了元件精密化及高密度贴装的趋势,而这也给整个SMT行业带来了深刻的影响。新型元器件的不断出现与应用,使得印制电路板(PCB)上的元器件密度增加,IC芯片引脚距离变小,同时元件的尺寸也越来越小。近年来由于精密元器件的单价降低,即便是贴装面积充足的板面也采用使用精密元件的设计等等事例也经常发生。在这种元件精密
For the 21st century, a highly informative society, the rapid development of electronic machinery, mobile phones and a variety of small and light automatic mechanical and universal development accelerated the trend of component precision and high-density placement, and this also brought to the entire SMT industry A profound impact. The emergence of new components and applications, making the printed circuit board (PCB) on the increase in component density, IC chip pin distance becomes smaller, while the size of the components are getting smaller and smaller. In recent years, due to lower the price of precision components, even the placement of adequate surface area also uses the use of precision components design and so on examples also occur. The precision of such components