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研究了BaTiO3颗粒对SnAgCu钎料组织和性能的影响。结果表明,添加的BaTiO3颗粒可以充当钎料凝固过程中异质形核质点,明显细化钎料中的β-Sn相,使共晶组织弥散分布在β-Sn晶界处。铺展性能随着BaTiO3含量的增加先上升后下降,当颗粒含量为0.2wt%时,铺展面积达到最佳值,为8.3 mm2,增幅为SnAgCu钎料的12%。SAC-x BaTiO3复合钎料的显微硬度值在细晶强化机制和第二相弥散强化的作用下得到了一定程度的提高,BaTiO3颗粒的最佳添加量为0.2wt%。
The effect of BaTiO3 particles on the microstructure and properties of SnAgCu solder was studied. The results show that the addition of BaTiO3 particles can act as heterogeneous nucleation sites during the solidification of the brazing filler metal, significantly refine the β-Sn phase in the brazing filler metal, and disperse the eutectic structure at the β-Sn grain boundaries. The spreading performance first increases and then decreases with the increase of BaTiO3 content. When the content of BaTiO3 is 0.2wt%, the spreading area is the best, which is 8.3mm2, an increase of 12% for SnAgCu solder. The microhardness of SAC-xBaTiO3 composite brazing filler metal has been improved to a certain extent by the fine grain strengthening mechanism and the second phase dispersion strengthening. The optimal addition amount of BaTiO3 particles is 0.2wt%.