为降低陶瓷与陶瓷或金属的连接温度 ,目前采用的连接方法有过渡液相扩散连接、半固态连接、机械连接、粘接、铟封和陶瓷表面低温改性后低温钎焊等。本文从上述连接方法的原理设计、连接材料设计与制备、接头性能及各自的优缺点等方面综述了陶瓷与陶瓷或金属低温连接研究的现状。 In order to reduce the connection temperature between ceramic and ceramic or metal, the current connection methods include transitional liquid phase diffusion bonding, semi-solid connection, mechanical connection, bonding, indium sealing and low temperature brazing after low temperature modification on ceramic surface. In this paper, the current situation of research on the low temperature connection between ceramic and ceramic or metal is reviewed in terms of the principle design of the above connection method, the design and preparation of the connection material, the properties of the joints and their respective advantages and disadvantages.