随着电子技术的不断发展,电子元件的功能高度一体化,出现了大量名为“载体芯片”的新型有源元件:因为这样制成的半导体元件要求的连接线越来越多,人们重新考虑经典的双列直插式(DIL)壳体封装法,研制了一种扁平封装壳体,其输出连接线分布于外壳周围。这就导致元件和印刷电路板的连接采用平面焊接,而不再用孔焊接。估计孔 With the continuous development of electronic technology, the functions of electronic components are highly integrated. There are a large number of new active components called “carrier chips”: because the semiconductor components thus manufactured require more and more connecting lines, people Reconsideration of the classic dual in-line (DIL) housing package method, developed a flat package housing, the output connection cable distributed around the housing. This results in a planar soldered connection of the component to the printed circuit board and no longer soldered to the hole. Estimated hole