论文部分内容阅读
为了提高铜钨合金的使用性能、细化组织、消除合金夹杂、微孔等缺陷,对铜钨合金进行激光冲击处理,分析了激光冲击法制备铜钨合金触头材料的显微组织及相结构,研究了其电导率和耐磨粒磨损性能。结果表明,激光冲击处理后,合金组织中的钨得到明显细化且均匀分布,由处理前超过100μm的大颗粒钨粉变成尺寸仅为4~7μm,冲击细化层厚度为1002μm;铜钨合金经过激光重熔处理后,相成分并没有改变,说明合金中的铜和钨在激光冲击处理过程中(Ar气氛保护)不发生化学反应,可以最大限度的保持原有的电学特性;激光冲击处理对电导率影响不大,可以满足使用要求;在相同磨损条件下,铜钨合金冲击层相对磨损速度较小,耐磨性较铜钨合金未处理试样提高1.55倍。
In order to improve the serviceability of copper-tungsten alloy, refine the microstructure and eliminate the defects such as alloy inclusions and micropores, the laser impact treatment was performed on the copper-tungsten alloy. The microstructure and phase structure of the copper-tungsten alloy contact material prepared by laser shock method , Studied its electrical conductivity and abrasive wear resistance. The results show that after the laser shock treatment, the tungsten in the alloy structure is obviously refined and uniformly distributed, and the size of the tungsten particles is only 4 ~ 7μm and the thickness of the impact thinning layer is 1002μm, After laser remelting, the phase composition did not change, indicating that the alloy copper and tungsten in the laser shock treatment process (Ar atmosphere protection) does not react chemically, you can maximize the maintenance of the original electrical properties; laser shock The treatment has little effect on the conductivity and can meet the requirements of use. Under the same wear conditions, the relative wear speed of the impact layer of the Cu-W alloy is relatively small, and the abrasion resistance is 1.55 times higher than that of the Cu-Ti alloy untreated specimen.