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利用金相显微镜、扫描电镜(SEM)及能谱仪(EDS)、俄歇电子能谱(AES)、X射线衍射仪(XRD)、显微硬度计和材料试验机,分析了铜作中间过渡层材料时,热静压扩散连接铍/HR-1不锈钢接头的组织结构、微区成分和性能,探讨了扩散区成分,组织结构与性能的关系。研究表明:扩散迁移后的原Be/Cu界面是整个扩散连接区的最弱处,是试样的断裂位置;用铜作过渡材料后,较有效地阻碍了铍与不锈钢元素金属间化合物的生成,提高了扩散连接接头的性能。
The effects of copper as intermediate transition were analyzed by metallographic microscope, SEM and EDS, AES, XRD, microhardness tester and material testing machine The microstructures, microstructure and properties of the beryllium / HR-1 stainless steel joint were investigated by means of thermo-static pressure diffusion. The relationship between composition, microstructure and properties of diffusion zone was discussed. The results show that the original Be / Cu interface after diffusion and migration is the weakest point in the entire diffusion connection region and the fracture location of the sample. After using copper as the transition material, the formation of intermetallic compounds of beryllium and stainless steel is more effectively inhibited , To improve the performance of diffusion connector.