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本文提出了一种不同于传统切削加工方法和现有激光加工方法的新工艺——“激光切削”。将激光束聚焦成为光带,用以加热、熔化余量和零件分界面的微区,同时用剥离工具剥离已分离的切屑,并使工件相对聚焦激光束和剥离工具而运动,以进行剥离余量的“切削”过程。分析和计算表明,“激光切削”有可能克服传统切削加工方法的一些固有弱点。“激光切削”的力小,不存在刀具磨损,比能小,效率高。其切削性能不受被切材料机械性能所支配,有可能特别适合于加工高强度、高硬度、高耐热性和低导热性的材料,而这些材料是用传统切削加工方法所难以加工的。
This paper presents a different from the traditional cutting method and the existing laser processing method of new technology - “laser cutting.” The laser beam is focused into an optical band to heat and melt the micro-regions of the remainder and the part interface while stripping off the separated chips with a stripping tool and moving the workpiece relative to the focused laser beam and the stripping tool to allow for the stripping The amount of “cutting” process. Analysis and calculations show that “laser cutting” has the potential to overcome some of the inherent weaknesses of conventional machining methods. “Laser cutting” force is small, there is no tool wear, than a small, high efficiency. Its machinability is not dictated by the mechanical properties of the material being cut and may be particularly suitable for the processing of high strength, high hardness, high heat resistance and low thermal conductivity materials which are difficult to machine with conventional machining methods.