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综述了集成电路对铜基引线框架材料的性能要求,指出好的导电导热和强度性能是引线框架材料最主要的性能要求;讨论了铜基引线框架材料的国内外研究现状,指出我国的引线框架材料无论是质量还是数量都与其他工业发达国家有很大的差距,并指出微合金化铜基材料具有成为高强高导引线框架材料的潜力。
The performance requirements of copper-based lead frame materials are reviewed. It is pointed out that good conductive thermal conductivity and strength properties are the most important performance requirements of lead frame materials. The research status of copper-based lead frame materials at home and abroad is discussed, and the lead frame The material has a great gap with other industrialized countries, both in quality and quantity, and pointed out that the micro-alloyed copper-based material has the potential of becoming a high strength and high lead frame material.