1.写在前面最近,我们经常听到“接地包装”(EA-RTH PACKAGING)和“导电包装”(CO-NDUCTIVE PACKAGING)这些词汇,人们对这种包装的研究已走上正规,电子产品从原先的真空管发展到晶体管和二极管,而后采用集成电路(IC)、大规模集成电路(LSI)直至超大规模集成电路(ULSI),因此,去静电和分散电击电流这一大问题,就提到 1. In the recent past, we often hear the words “EA-RTH PACKAGING” and “CO-NDUCTIVE PACKAGING.” People are now studying formally this package. Electronic products from Previous vacuum tubes evolved into transistors and diodes, followed by integrated circuits (ICs) and large scale integrated circuits (LSIs) up to ULSI, so the big issue of de-electrification and dispersion shock currents was mentioned