论文部分内容阅读
1 前言 1.1 光致导通孔积层基板光致导通孔积层基板就是在内层板上涂布感光性树脂,设计的导通孔用光刻法在其表面形成布线,所谓光致导通孔积层板的原理在LSI上看到的是众所周知的。回顾用这种方法制造积层板:早在1980年日本电信电话公司(现NTT)茨城通讯研究所发表了专利(专利号为昭和55-41194号)之后大约经过10年时间,日本IBM已经把SLC(Surface Laminar Circuit)实用化了,所制成的中Φ150μm导通孔,提高了布线密度,并在安装面直接装配芯片得到验证。之后各社都积极的开发用于光致导通孔积层板的感光性树脂,采用感光性树脂可以一次作成数万个导通孔(曝光、显影)这一点用钻头和激光制作是不可能实现的。
1 Introduction 1.1 Photoconductive Vias Laminated Substrate Photoconductive Vias A laminated substrate is a substrate in which a photosensitive resin is applied. The designed vias are patterned by photolithography on their surfaces. The so-called photoconductive vias The principle of laminate is seen on LSI is well known. Recalling the production of laminates in this way: About 10 years after the patented publication of Ibaraki Telecommunications Research Institute (now NTT) in 1980 (Patent No. 55-41194), IBM Japan SLC (Surface Laminar Circuit) practical, made of Φ150μm vias, to improve the wiring density, and the mounting surface of the chip directly assembled to be verified. Since then, each agency has actively developed a photosensitive resin for a photoconductive via laminate, and it is impossible to manufacture a via hole and a laser using tens of thousands of vias (exposure and development) using a photosensitive resin of.