论文部分内容阅读
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature(HPHT) infiltration technique.Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters(temperature,pressure,and time).The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m.K) were achieved at the optimal sintering parameters of 1200oC,6 GPa and 10 min.It is found that the thermal conductivity of the composites depends strongly on sintering pressure.When the sintering pressure is above 6 GPa,the diamond skeleton is detected,which greatly contributes to the excellent thermal conductivity.
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. The microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W / (mK) were achieved at the optimal sintering parameters of 1200oC, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.