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在分析SMD封装型LED产品热学结构的基础上,提出了一种新的大功率LED照明灯具的器件结温估算方法,即通过测量预留在MCPCB上的测温点的温度估算LED结温。并对该方法应用于单颗器件及灯具进行了的实验评估。
Based on the analysis of the thermal structure of SMD LED package, a new method for estimating the junction temperature of high power LED lighting fixtures is proposed. The junction temperature of MCPCB is estimated by measuring the temperature of the MCPCB. The method was applied to the experimental evaluation of single devices and lamps.