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散热是大功率LED封装的关键技术之一,散热不良将严重影响LED器件的出光效率、亮度和可靠性。影响LED器件散热的因素很多,包括芯片结构、封装材料(热界面材料和散热基板)、封装结构与工艺等。文章具体分析了影响大功率LED热阻的各个因素,指出LED散热是一个系统概念,需要综合考虑各个环节的热阻,单纯降低某一热阻无法有效解决LED的散热难题。文中还对国内外降低LED热阻的最新技术进行了介绍。
Cooling is one of the key technologies of high-power LED package, poor heat dissipation will seriously affect the LED device’s light efficiency, brightness and reliability. LED devices affect the cooling of many factors, including the chip structure, packaging materials (thermal interface materials and cooling substrate), packaging structure and technology. The paper analyzes various factors that affect the thermal resistance of high power LEDs. It is pointed out that LED heat dissipation is a systematic concept, and the thermal resistance of each link needs to be considered comprehensively. Simply lowering a certain thermal resistance can not effectively solve the heat dissipation problem of LED. The article also introduces the latest technologies to reduce LED thermal resistance at home and abroad.