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据《Semiconductor FPD World》2005年第2期报道,日本精工爱普生公司采用本公司开发的喷墨技术,成功制作了20层叠层电路基板。该公司将分散于液体中的数nm-数+nm银微粒子的墨水和新开发的绝缘体墨水用喷墨法交互式进溅射和叠层,成功地制作了20层叠层电路基板。制作
According to “Semiconductor FPD World” 2005 the second period reported that Japan’s Seiko Epson company developed inkjet technology, successfully produced 20 layers of laminated circuit substrate. The company succeeded in producing 20 layers of laminated circuit substrates by interactively sputtering and laminating a few nm-number + nm silver fine particles dispersed in a liquid with a newly developed insulator ink using an ink jet method. Production