论文部分内容阅读
采用超细９５％Ａｌ２Ｏ３粉料、高温烧结、陶瓷激光精密加工工艺制成的管壳，可满足毫米波器件的封装要求。
The use of ultrafine 95% Al2O3 powder, high temperature sintering, ceramic laser precision machining process made of shell, millimeter wave devices to meet the packaging requirements.