由于集成电路制造工艺的不断提高 ,集成电路的设计规模遵循Moore定律持续向前发展 ,并出现了系统级芯片 (SOC)这一新的集成电路设计概念 .同时遇到的困难之一是互连线成为影响电路性能的决定因素 :芯片速度变慢、功耗增大、噪声干扰加剧 .若采用以往基于直角互连结构的基础模型进行互连线性能的优化 ,其能力受到限制 .于是 ,人们试图采用其他互连结构作为突破途径 ,以实现高性能的集成电路 .在这种技术需求与目前工艺支持的背景下 ,从 2 0世纪 90年代初出现的关于非直角互连的零散的、试探性的研究 ,将成为国际上布线领域新的热点研究方向 .文中将针对非直角布线方面以往零散的研究工作进行总结与分析 ,指出了目前需要解决的关键技术 ,并结合自己的研究工作基础提出了可行的技术路线与设想 . Due to the ever-increasing manufacturing process of integrated circuits, the design scale of integrated circuits follows Moore’s law and continues to evolve, and the concept of system-on-chip (SOC), a new integrated circuit design, has emerged. One of the difficulties encountered is that interconnection The line becomes the decisive factor that influences the circuit performance: The chip is slowed down, the power consumption is increased, the noise disturbance aggravates.If the ability of using the basic model based on rectangular interconnection structure to optimize the interconnection performance is limited, people Attempts to use other interconnect structures as breakthroughs to achieve high-performance integrated circuits, in the context of this technological need and current process support, sporadic, temporally non-rectangular interconnections that emerged from the early 1990’s, This research will summarize and analyze the scattered work in the field of non-right-angle wiring and point out the key technologies that need to be solved at present, and put forward the basis of their own research work Feasible technical routes and ideas.