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本刊定于9月19日—21日(9月19日报到)将在浙江杭州举办“全国机电产品运输包装技术改进暨降本方案推广”研讨会。会议主要内容:机电产品运输包装现状及发展趋势;机电产品包装损坏和不规范包装案例分析;机电产品钢制包装箱的设计与应用;框架木箱的设计及案例分析;特大型木质结
This issue is scheduled for September 19 -21 days (September 19 registration) will be held in Hangzhou, Zhejiang “National Electrical and Mechanical Products Transport Packaging Technology Improvement and cost reduction program promotion ” seminar. The main contents of the meeting: the status quo and development trend of transport packaging of mechanical and electrical products; mechanical and electrical packaging damage and non-standard packaging case analysis; mechanical and electrical products design and application of steel crates; frame wooden case design and case analysis;