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InSb红外探测器芯片镀金焊盘与外部管脚的引线键合质量直接决定着光电信号输出的可靠性,对于引线键合质量来说,超声功率、键合压力、键合时间是最主要的工艺参数。从实际应用出发,采用K&S公司4124金丝球焊机实现芯片镀金焊盘与外部管脚的引线键合,主要研究芯片镀金焊盘第一焊点键合工艺参数对引线键合强度及键合区域的影响,通过分析键合失效方式,结合焊点的表面形貌,给出了适合InSb芯片引线键合质量要求的最优工艺方案,为实现InSb芯片引线键合可靠性的提高打下了坚实的基础。
InSb infrared detector chip gold-plated pad and the external pin lead bonding quality directly determines the reliability of the optical signal output, the wire bonding quality, ultrasonic power, bonding pressure, bonding time is the main process parameter. Starting from the practical application, K & S Company 4124 gold wire ball welder is used to realize the wire bonding of the gold plated pads and the external pins of the chip. The main research is the bonding parameters and the bonding parameters By analyzing the bonding failure modes and the surface topography of the solder joints, the optimum process scheme for the wire bonding quality of the InSb chip is given, which has laid a solid foundation for the improvement of the reliability of the wire bonding of the InSb chip Foundation.