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目前制版工艺大多采用超微粒干版进行分步重复照相,然后复印成阴版,再利用阴版制成光刻版。如果能用光刻胶涂在金属版(氧化铁版或铬版)上进行制版,以此代替超微粒干版,就可以节约银盐,降低成本,提高质量,简化工艺。因此,用光刻胶取代超微粒干版的工艺,在国内外受到广泛重视,正在大力研究与试用。在吸取有关兄弟单位经验的基础上,我们在用光刻胶代替超微粒干版工艺上进行了尝试。几个月来,我们先后试制了运算放大器BG305、集成稳压器、AD转换器等几种线性集成电路的阴版、光刻版,图形的最细线条是10微米,经试用,图形完好率和(大长)准性均良好。由此可见,光刻胶用于分步重复照相工艺是可能的。
Currently most of the plate making process using ultra-fine particles of dry version of the step-by-step repeat photography, and then copy into the negative version, and then use the negative version made of lithography. If you can use photoresist coated on the metal plate (iron oxide plate or chromium plate) on the plate, in order to replace the ultra-fine dry plate, you can save silver salt, reduce costs, improve quality and simplify the process. Therefore, the use of photoresist to replace the microparticle dry-plate process, at home and abroad have received widespread attention, is vigorously research and trial. In drawing on the experience of the brothers unit, based on the use of photoresist instead of ultra-fine particles of dry plate on the attempt. Over the past few months, we have trial-produced the operational amplifier BG305, integrated voltage regulator, AD converter and several other linear integrated circuits of the lithography, lithography, the thinnest lines of the graphics is 10 microns, the trial, the graphics intact rate And (long) are good standards. Thus, it is possible to use a photoresist for a step-and-repeat photography process.