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在毫米波系统级封装(System-On-Package,SOP)中,需要一种宽带、小型化、易集成的板间垂直互联电路,以实现不同功能层之间毫米波信号的可靠互联。不同于常规基片集成波导(SIW),提出一种基于Z向基片集成脊波导(Substrate-Integrated-Riged-Waveguide,SIRW)的毫米波板间垂直互联结构。该结构体积小、易集成,可与多层基板加工工艺兼容、一体化同步实现。最后利用低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)加工工艺,制作了背靠背互联实物,电路接口尺寸2.2 mm×1.3 mm,经测试在28~36 GHz频带内实现单个互联插损小于0.45dB,带内平坦度优于±0.5 dB,回波损耗优于-12 dB。
In system-on-package (SOP) millimeter-wave systems, there is a need for a broadband, miniaturized and easily integrated vertical inter-board interconnection circuit to achieve reliable interconnection of millimeter-wave signals between different functional layers. Different from the conventional SIW, a vertical inter-millimeter wave structure based on Z-substrate integrated waveguide (SIRW) is proposed. The structure of small size, easy integration, multi-layer substrate processing technology compatible with the integration of simultaneous implementation. Finally, the back-to-back interconnects were fabricated using a low temperature Co-fired Ceramic (LTCC) process. The circuit interface size was 2.2 mm × 1.3 mm. The single interconnect loss measured in the 28-36 GHz band was less than 0.45 dB, in-band flatness better than ± 0.5 dB and return loss better than -12 dB.