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随着电子科学技术的迅猛发展,特别是航天航空、军事电子、通讯设备、计算机、汽车电子、消费类电子等产业,要求电子产品具有高性能、多功能、小型化、薄型化、轻量化、携带方便,以及大众化、低成本等特点,要求SMT 设备向高速度、高精度、多功能的方向发展。同时,由于新的片式元器件及封装方式在不断变化,例如QFP、BGA、FC、COB、CSP、MCM等大量涌现和推
With the rapid development of electronic science and technology, especially in industries such as aerospace, military electronics, communications equipment, computers, automotive electronics, and consumer electronics, electronic products are required to have high performance, versatility, miniaturization, thinness, and light weight. Easy to carry, as well as popularization, low cost and other characteristics require SMT equipment to develop in the direction of high speed, high precision and multi-functionality. At the same time, new chip components and packaging methods are constantly changing, such as QFP, BGA, FC, COB, CSP, MCM, etc.