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本文讨论了干法腐蚀工艺中作掩蔽的抗蚀剂和抗蚀剂系统.分析了在以等离子体为主的干法腐蚀工艺中增强抗蚀剂耐腐蚀能力、降低抗蚀剂腐蚀速率的几种方法.通过实验表明,等离子腐蚀前对抗蚀剂进行等离子体辐照的抗蚀剂处理技术,非常适合于目前国内半导体工艺3~5μm微细加工的需要.
In this paper, the masking resists and resist systems are discussed in the dry etching process.The effects of increasing the corrosion resistance of the resist in the plasma-based dry etching process and the corrosion rate of the resist The experiment shows that the plasma treatment before resist plasma etching is very suitable for the current 3 ~ 5μm microfabrication in semiconductor process.