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多物理场耦合有限元方法被用来模拟光抽运垂直外腔面发射半导体激光器(OPS-VECSEL)内部的热分布情况,特别对OPS-VECSEL芯片帽层表面与金刚石散热片毛细键合(capillary bond)的情况做了计算。计算表明,在没有金刚石散热片的情况下,从窗口以下首个量子阱到末个量子阱的温差达到150 K;在有金刚石散热片的情况下,器件中各个量子阱的温差很小,其共振波长差只有几纳米;在芯片的分布式布拉格反射镜(DBR)一侧焊接有硅微通道冷却器的情况下,各量子阱间的温差进一步减小,器件性能得到最大改善。模拟计算也表明,在抽运功率不变的情况下,适当增加抽运光的半径,可显著降低器件的热效应,尤其热透镜效应。
The multi-physics coupled finite element method is used to simulate the heat distribution inside the OPS-VECSEL, especially for the surface of the OPS-VECSEL chip cap and the diamond heat sink bond is calculated. Calculations show that in the absence of a diamond heat sink, the temperature difference from the first quantum well below the window to the last quantum well reaches 150 K; in the case of a diamond heat sink, the temperature difference between the individual quantum wells in the device is small, The resonance wavelength difference is only a few nanometers. When the silicon micro-channel cooler is soldered on the DBR side of the chip, the temperature difference between the quantum wells is further reduced and the device performance is greatly improved. The simulation also shows that appropriately increasing the radius of pumping light under the same pumping power can significantly reduce the thermal effect of the device, especially the thermal lens effect.