采用真空蒸镀与化学镀两种方法制备GaN基发光二极管(LED)金电极,分析比较了两种工艺所得芯片成本、外观色差、打线拉力。结果表明,化学镀金可选择性还原欲沉积的金属于电极上,较之蒸镀整面金属,可大幅度节省金属成本,且操作简单易行。化学镀金法所制得金属层,较蒸镀法所制得金属层表面粗糙,可有效减少电极间的色差,且能提高打线或焊线的附着力。 GaN-based light-emitting diode (LED) gold electrodes were prepared by vacuum deposition and electroless plating. The chip cost, appearance color difference and wire pulling tension of the two processes were analyzed and compared. The results show that electroless gold plating can selectively reduce the metal to be deposited on the electrode, which can greatly save the metal cost compared with the whole metal evaporation, and the operation is simple and easy. The metal layer obtained by the electroless gold plating method has a rougher surface than the metal layer obtained by the evaporation method, which can effectively reduce the color difference between the electrodes and improve the adhesion of the bonding wire or the bonding wire.