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以低结构CB(炭黑)为导电填料、EP(环氧树脂)为基体、CTBN(端羧基液体丁腈橡胶)为改性剂和2,4-EMI(2-乙基-4-甲基咪唑)为固化剂,采用超声分散法制备CB/EP基导电复合材料。研究结果表明:CB/EP基导电复合材料具有明显的导电渗流行为,其渗流阈值为w(CB)=7.1%;当w(CTBN)=12%时,含CTBN体系的导电复合材料的室温体积电阻率比不含CTBN体系的导电复合材料降低了近1个数量级;含CTBN体系的导电复合材料仍具有正温度系数(PTC)效应,但PTC转变温度和最大体积电阻率所对应的温度均有所降低。
Low-structure CB (carbon black) as the conductive filler, EP (epoxy resin) as the substrate, CTBN (carboxyl carboxyl liquid nitrile rubber) as a modifier and 2,4-EMI Imidazole) as curing agent, the CB / EP-based conductive composites were prepared by ultrasonic dispersion method. The results show that the conductive percolation behavior of CB / EP-based composites is very good. The percolation threshold of CB / EP composites is 7.1%. At w (CTBN) = 12% The resistivity is lower by nearly one order of magnitude than that of conductive composites without CTBN. The conductive composites with CTBN still have a positive temperature coefficient (PTC) effect, but the temperatures corresponding to the PTC transition temperature and the maximum volume resistivity Reduced.