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随着微电子制造商持续缩小晶体管基极和其他元件的尺寸,集成电路的密度不断增大,电路连接工艺中开始使用低k介电质和铜导电体。为了进一步提高电路整体性能与射电频率性能、缩小体积、降低电源损耗、提高散热效率,承载电路的基片的厚度正在持续变薄。常规的工艺已经无法加工先进的超薄基片。为了解决这个工艺中的难题,BrewerScience利用自己先进的材料、工艺、机械设备的研究开发水平,正在开发一套崭新的超薄基片的加工操作流程。介绍用于将超薄基片暂时粘结到另一载体的系列材料和流程,完成加工以后,基片和载体可以很容易地分离。另外,对用于保护基片的新型涂料也进行了介绍。在对基片进行薄化和切割的时候,这种涂料可以对基片提供有效的保护。最后,介绍了高透明高折射材料,这些材料用在高亮度发光二极管(HB-LED)和微光电机械系统(MOEMS)中,可以降低由封装引起的光损耗。
As microelectronic manufacturers continue to shrink the size of the transistor base and other components, the density of integrated circuits continues to grow, with low-k dielectrics and copper conductors beginning to be used in the circuit-bonding process. In order to further improve the overall performance of the circuit and radio frequency performance, reduce size, reduce power consumption and improve heat dissipation efficiency, the thickness of the substrate carrying the circuit is continuously thinning. Conventional processes have been unable to process advanced ultra-thin substrates. To address the challenges in this process, BrewerScience is developing a new, ultra-thin substrate processing workflow using its advanced research and development of materials, processes and machinery. A series of materials and procedures are described for temporarily bonding an ultra-thin substrate to another carrier. After processing, the substrate and carrier can be easily separated. In addition, the new coatings used to protect the substrate are also described. This coating provides effective protection of the substrate during thinning and cutting of the substrate. Finally, high transparent, high refractive materials are introduced that are used in high brightness light emitting diodes (HB-LEDs) and micro-optoelectromechanical systems (MOEMS) to reduce the package-induced light loss.