论文部分内容阅读
本文定量的研究了自动锡焊过程中五种助焊剂的预热温度。研究结果表明:焊剂内含活性物质的分子间极性愈大,在清洁的铜表面上自然流散面积愈小;反之,则大,因此松香焊剂流散面积为最大。在松香焊剂中增加活性物质,它们去除氧化铜能力比原松香焊剂所需的预热温度要下降40～60℃。采用相邻各档予热温度(温差20℃)对除氧化铜能力的百分变化,求得五种助焊剂的最佳预热温度,它们分别为:松香焊剂:102～116℃;标2焊剂:104～118℃;标3焊剂:80～89℃;“三S”焊剂102～130℃;Gx-7焊剂(日本):108～134℃,同时测得了各种助焊剂的最高活化温度(第二峰值)。通过一系列研究,我们认为在自动锡焊中,推荐助焊剂通用的预热温度范围:100±10℃是比较适宜的。
This paper quantitatively studied the five soldering flux preheating temperature in automatic soldering process. The results show that the greater the intermolecular polarity of the active material contained in the flux, the smaller the natural run-off area on the clean copper surface and the larger the flux area on the cleaned copper surface. In the rosin flux to increase the active substances, their ability to remove copper oxide rosin flux than the required pre-heating temperature to be reduced 40 ~ 60 ℃. The best preheating temperature of five fluxes was obtained by using the adjacent temperature and temperature (20 ℃) as a percentage change in the capacity of copper oxide. They were: Rosin flux: 102-116 ℃; Flux: 104-118 ℃; standard 3 flux: 80-89 ℃; “S” flux 102-130 ℃; Gx-7 flux (Japan): 108-134 ℃; meanwhile, the highest activation temperature (Second peak). Through a series of studies, we believe that in the automatic soldering, it is more appropriate to recommend a general preheating temperature range of flux: 100 ± 10 ° C.