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激光直接成像和装置的变革Laser Direct Imaging and Structuring:An Update 印制板的线条与间距越来越小,50/50mm甚至25/25mm的板子在增多,为了满足更细线条与间距的要求,需要投入激光直接成像(LDI)。本文介绍了在世界范围应用LDI的分布比例,欧洲最多;世界上主要的LDI设备制造商及其所占市场份额,最大的Orbotech占一半多,还介绍了YAG UV激光和准分子激光的工作原理及性能特点,采用LDI的成本比较等。(By Christophe Vaucher等Circuitree 2002/8 共3页)
Laser direct imaging and device innovation Laser Direct Imaging and Structuring: An Update PCB lines and spacing smaller and smaller, 50 / 50mm or 25 / 25mm board is increasing, in order to meet the needs of thinner lines and spacing requirements Put into direct laser imaging (LDI). This article describes the distribution of LDI worldwide, the largest in Europe; the world’s leading manufacturers of LDI devices and their share of the largest Orbotech accounted for more than half of the YAG UV laser and excimer laser also describes the working principle And performance characteristics, the cost of using LDI and more. (By Christophe Vaucher et al. Circuitree 2002/8 of 3)