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【编者按】实施无铅工艺以及元器件封装的微型化,给电子组装技术带来了很大的挑战。第一,无铅焊接峰值温度提高,使焊接工艺窗口由50℃减小到15℃;第二,焊料、PCB(Printed Circuit Board,印制电路板)表面处理、元件焊端表面处理的多元化,出现了兼容性问题;第三,超大超薄BTC(Bottom Terminal Component,底部焊端元器件)类封装的动态变形对组装质量的影响越来越大。这些都导致新的焊接问题、新的焊接不良现象、新的组装失效模式。本刊特邀《SMT核心工艺解析与案例分析》作者、中兴通讯首席工艺专
[Editor’s note] The implementation of lead-free process and the miniaturization of components and packaging, electronic assembly technology has brought great challenges. First, the lead-free solder peak temperature increases, the welding process window from 50 ℃ to 15 ℃; Second, solder, PCB (Printed Circuit Board) surface treatment, , There is a compatibility problem. Third, the dynamic deformation of the ultra-thin Bottom Terminal Component package has an increasing impact on the assembly quality. These all lead to new welding problems, new welding problems, and new assembly failure modes. The magazine invited “SMT core process analysis and case analysis” author, ZTE chief technology specialist