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用示差扫描量热（ＤＳＣ），硬度测量等方法研究了无限互溶系统的Ａｇ－Ａｕ合金在Ａｕ含量小于５ｗｔ．％，溶质Ａｕ及不同变形量对该合金再结晶温度Ｔｒ的影响，并与有限固溶系统Ａｇ－Ｃｕ合金进行了比较。结果表明：Ａｕ对基体Ａｇ的再结晶有一定阻碍作用，但与Ｃｕ相比，这种作用小得多。变形量越大，Ａｇ－Ａｕ合金的再结晶温度越低。讨论了Ａｇ－Ａｕ合金的再结晶表观激活能，激活能随Ａｕ含量的变化与Ａｕ含量对再结晶温度的影响基本吻合。
The differential scanning calorimetry (DSC), hardness measurement and other methods were used to study the properties of Ag-Au alloy in an infinitely soluble system with the Au content less than 5wt. %, Solute Au and different amount of deformation of the alloy recrystallization temperature Tr, and with the limited solid solution system Ag-Cu alloy were compared. The results show that Au has a certain hindering effect on the recrystallization of matrix Ag, but this effect is much smaller than that of Cu. The greater the amount of deformation, the lower the recrystallization temperature of the Ag-Au alloy. The apparent activation energy of recrystallization of Ag-Au alloy is discussed. The activation energy varies with the content of Au and the effect of Au content on the recrystallization temperature basically agrees.