论文部分内容阅读
采用中频非平衡磁控溅射离子镀技术在硬质合金基体YG6上制备TiAlN薄膜。利用XRD、EDS、体式显微镜、显微硬度仪和多功能材料表面性能测试仪等对其组织结构以及性能进行了研究分析。结果表明:低Al靶功率时,膜层以TiN、TiC形式存在,TiN的择优取向面(111),显微硬度与偏压有关;高Al靶功率时,膜层主要存在Ti3AlN、AlN相,Ti3AlN相沿(220)晶面择优取向;膜层结构致密均匀,N原子与金属原子比接近1:1;膜层厚度为1.93μm;显微硬度3145HV;结合力85N。
TiAlN thin films were prepared on cemented carbide substrate YG6 by IF IFBM. The microstructures and properties of the composites were investigated by XRD, EDS, bulk microscope, microhardness tester and multi-functional surface property tester. The results show that the TiN and TiC films exist at low Al target power. The preferred orientation of TiN (111) and the microhardness are related to the bias voltage. At the high Al target power, Ti3AlN and AlN phases mainly exist in the film, Ti3AlN phase has a preferred orientation along the (220) crystal plane. The film structure is dense and uniform, the atomic ratio of N atoms to metal is close to 1: 1, the film thickness is 1.93μm, the microhardness is 3145HV and the binding force is 85N.