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研究了过热度、冷却速率和时效处理对Sn-9Zn/Cu界面金属间化合物的形成及厚度的影响,并与同等条件下的Sn-3.5Ag-0.7Cu/Cu和Sn-37Pb/Cu界面作了比较。通过XRD、SEM及EPMA等检测发现,在Sn-9Zn/Cu界面上形成的金属间化合物可分为2层:近Cu侧的Cu-Zn化合物层和近焊料侧的Cu-Zn-Sn化合物层,同时在2层化合物的分界面上还检测出了大量的O。试验还发现,熔融过热度和冷却速率对焊料/Cu界面上金属间化合物的厚度有较大影响,随着熔融保温温度的升高和冷却速率的下降,厚度增加,且Sn-9Zn/Cu和Sn-3.5Ag-0.7Cu/Cu界面受熔融过热度和冷却速率的影响比Sn-37Pb/Cu界面大。在250℃+空冷的时效过程中,由于界面上Cu-Zn化合物层分解和Cu-Zn-Sn化合物层生长相互竞争,导致Sn-9Zn/Cu界面金属间化合物的厚度变化无明显规律。
The effects of superheat, cooling rate and aging treatment on the formation and thickness of Sn-9Zn / Cu interface intermetallic compounds were investigated and compared with that of Sn-3.5Ag-0.7Cu / Cu and Sn-37Pb / Cu interfaces under the same conditions A The results of XRD, SEM and EPMA showed that the intermetallic compound formed on the Sn-9Zn / Cu interface can be divided into two layers: the Cu-Zn compound near Cu and the Cu-Zn-Sn near solder , While a large amount of O was also detected at the interface of the two-layer compound. It is also found that the superheat degree and cooling rate have a great influence on the thickness of the intermetallic compound on the Cu / Cu interface. With the increase of the melting temperature and cooling rate, the thickness of Sn-9Zn / Cu and The Sn-3.5Ag-0.7Cu / Cu interface is more affected by the degree of superheat and the cooling rate than the Sn-37Pb / Cu interface. During the aging process at 250 ℃ and air cooling, the thickness of intermetallic compound Sn-9Zn / Cu did not change obviously due to the mutual decomposition of Cu-Zn compound layer and Cu-Zn-Sn compound layer at the interface.