随着新技术的发展,半导体的需要量愈来愈大。但由于锗、硅等半导体材料质地硬脆,多数生产单位都是用钼锯条来切割成型。运用这种加工方法,不仅劳动生产率低,而且材料利用率低,废品率高。半导体材料价格昂贵,所以生产成本也高。因此改进切割加工方法,成为半导体管生产中的一个关 With the development of new technologies, the demand for semiconductors is getting bigger and bigger. However, due to the brittle texture of semiconductor materials such as germanium and silicon, the majority of production units use molybdenum saw blades for cutting and forming. Use of this processing method, not only low labor productivity, but also low material utilization, high rejection rate. Semiconductor materials are expensive, so the production costs are high. Therefore, improving the cutting method, a semiconductor tube production off