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采用磁控溅射法在玻璃衬底上制备了Cu薄膜 ,应用台阶仪测量Cu膜的厚度 ,研究了薄膜的沉积速率与溅射功率的关系 ;用X射线衍射 (XRD)和扫描电镜Cu对薄膜进行了表征 ,研究了溅射功率对所制备薄膜的影响。制备出致密性和均匀性较好的Cu薄膜。
Cu film was prepared on glass substrate by magnetron sputtering method. The thickness of Cu film was measured by using stepper. The relationship between deposition rate and sputtering power was studied. X-ray diffraction (XRD) and scanning electron microscopy The films were characterized and the effect of sputtering power on the prepared films was investigated. A dense and uniform Cu thin film was prepared.