介绍了晶片表面Haze值的定义和理论依据,通过对SSIS系统的原理分析,揭示了Haze是一种间接反映晶片表面状态的光学信号。通过对不同表面状态抛光片的光学扫描,研究了晶片表面粗糙度与Haze值的关系;通过对Si抛光片和砷化镓抛光片的扫描对比,研究了晶片本体反射系数对Haze值的影响。研究结果表明,同种材料的Haze值随着表面粗糙度的增大而增大,而不同的材料即使拥有相似的表面粗糙度,Haze值也会因本体反射系数的不同而呈现很大差异。通过对Haze扫描图的特征分析,研究了Haze值分布与晶片表面均匀性的关系,成功地利用Haze值分布将表面性状化,为化学机械抛光和湿法清洗工艺提供了一个新的反馈手段。 The definition and theoretical basis of the Haze value of the wafer surface are introduced. By analyzing the principle of the SSIS system, it is revealed that Haze is an optical signal indirectly reflecting the surface state of the wafer. The relationship between the surface roughness and the Haze value was studied through the optical scanning of the polishing films with different surface states. The influence of the reflection coefficient of the bulk wafer on the Haze value was studied by scanning comparison between the Si polishing film and the gallium arsenide polishing film. The results show that the Haze value of the same material increases with the increase of the surface roughness. However, even if different materials have similar surface roughness, the Haze value will vary greatly depending on the body reflection coefficient. By analyzing the characteristics of the Haze scan map, the relationship between the Haze distribution and the uniformity of the wafer surface has been studied. Successfully using the Haze distribution to characterize the surface, it provides a new feedback mechanism for chemical mechanical polishing and wet cleaning processes.