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一、器件研究 1.1 引言本实验的主要目的是研究一种新的器件工艺,用以制作高效率的电子转移振荡器。我们在这方面的努力已经获得成功,已经研究出一种集成热沉工艺,所得器件的结果是:典型的器件效率是6～9％(而用原来的工艺所得到的效率为3～5％),获得的最佳效率为14％,这是连续波电子转移振荡器迄今为止所报导的最高效率。对于制作超声键合器件来说,与原来的工艺相比,集成热沉工艺的主要优点如下:
I. DEVICE RESEARCH 1.1 INTRODUCTION The main purpose of this experiment is to study a new device process for the fabrication of highly efficient electron transfer oscillators. Our efforts in this area have been successful and an integrated heat sink process has been developed that results in typical device efficiencies of 6 to 9% (compared to 3 to 5% with the original process) ), The best efficiency achieved was 14%, which is the highest efficiency ever reported by a continuous wave electron transfer oscillator. For the production of ultrasonic bonding devices, compared with the original process, the main advantages of integrated heat sink process are as follows: