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由电子工业部工艺研究所主持召开的电子工业部粘接技术协作组大区组长厂(所)工作会议,于1984年6月2日至4日在北京召开。出席这次会议的代表有19个单位25人。部科技司基础处武琪处长、部工艺研究所张立鼎所长参加了会议。雷达工业管理局、元器件工业管理局都派代表参加了会议。12所的张振祥副所长也到了会。这次会议主要是总结汇报1978年宜昌会议以来的工作情况;并讨论今后如何进一步开展电子工业系统粘接技术交流工作。大会除了两天紧张的汇报与讨论外,会议期间还组织参观了12所的理化检测等一些应用设
By the Ministry of Electronics Industry Institute of Technology held in the Ministry of Electronics Industry Adhesive Technology Cooperation Group, the regional team leader factory (the) working conference, in June 1984 June 2-4 held in Beijing. Delegates attending the meeting had 19 units and 25 persons. Department of Science and Technology Department based Wuqi Director, Institute of Technology Zhang Liding director attended the meeting. Radar Industry Authority, Component Industry Authority sent representatives attended the meeting. Zhang Zhenxiang, deputy director of 12 also arrived. The meeting mainly summarizes the work since the Yichang meeting in 1978 and discusses how to further develop the system bonding technology exchange in the future. In addition to two days of intense reports and discussions, the conference also organized visits to 12 applications of some physical and chemical testing