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本文研究了直流多靶溅射Pt_5Si_2—Ti—Pt—Au多层金属化系统的溅射条件并讨论了梁式引线和肖特基势垒二极管的生成机理。
In this paper, the sputtering conditions of multi-target sputtering of Pt_5Si_2-Ti-Pt-Au multi-layer metallization system were studied and the formation mechanism of beam lead and Schottky barrier diode were discussed.