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电子工业部华东地区第三次胶粘技术经验交流会于1984年3月23日至27日在福建省漳州市召开。参加会议的有51个单位61名代表。其中有应邀参加会议的上级机关领导和同志及电子工业部各大区组长厂、南京大学、厦门大学、北京化工学院、化工部等14个单位的代表。会议共收到技术资料30多篇,其中有14篇在大会上进行了交流。会议通过大会报告、小组讨论等多种形式,对胶接理论(如配价键理论)、偶联剂、导电胶、阻尼胶、
Ministry of Electronics Industry East China third glue technology experience exchange was held in March 23, 1984 to 27 in Zhangzhou City, Fujian Province. There were 61 representatives from 51 units participating in the conference. Among them, leaders and comrades of higher authorities invited to attend the conference and heads of major regions in the Ministry of Electronics Industry, representatives of 14 units including Nanjing University, Xiamen University, Beijing Institute of Chemical Technology and the Ministry of Chemical Industry, among others. The meeting received a total of more than 30 technical papers, of which 14 were exchanged at the General Assembly. Meeting through the report of the General Assembly, panel discussions and other forms of adhesive bonding theory (such as valence bond theory), coupling agent, conductive plastic, damping rubber,