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TPV市场以及厂内chamber端陆续反馈电源板打火死机异常不良,针对此异常,TPV成立专案组织,使用6 sigma DMAIC的思路,分析其产生原因为板面电迁移导致电路导通打火。针对离子产生的源头进一步分析后,导入原板离子浓度、绝缘阻抗测试,在设计阶段针对高风险点位增加开槽或者点胶的动作,并优化了锡炉喷雾系统的参数,从而大幅度了降低板面电迁移的风险几率。
TPV market and the chamber end gradually feedback power supply board fire abnormal crashes, in response to this anomaly, TPV set up the project organization, the use of 6 sigma DMAIC ideas, analysis of its causes for the board electromigration lead to circuit conduction. After further analysis of the source of ion generation, the original ion concentration and insulation resistance test of the ion source were introduced into the reactor. Slotting or dispensing was added to the high-risk point in the design stage, and the parameters of the tin spray system were optimized, thus drastically reducing Risk of electromigration on the board.