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用真空阴极过滤电弧(Filtered Cathode Vacuum Arc,FCVA)法制备厚度分别为50 nm,30 nm,10 nm,5 nm,2 nm的类金刚石(DLC)薄膜,利用拉曼光谱和电子能量损失谱研究了薄膜的结构,分析了硬度和内应力的变化趋势。结果表明,随着薄膜厚度的减小,可见光拉曼光谱高斯分解的G峰位置向低波数方向移动,D峰和G峰强度之比Id/Ig不断增大,G峰面积与D峰面积之比Ag/Ad减小;说明随着薄膜厚度的减小,DLC薄膜中的sp3键含量减少,有序化的sp2团簇增加。电子能量损失谱的结果也表明薄膜厚度的减小会引起薄膜中sp3键含量的减少。当薄膜的厚度由50 nm变为30 nm时,薄膜硬度由53.85 GPa减小为39.64 GPa,内应力由4.63 GPa降低为3.47 GPa,随着厚度降低,薄膜的硬度和内应力呈下降趋势。
Diamond-like carbon (DLC) films with thickness of 50 nm, 30 nm, 10 nm, 5 nm and 2 nm were prepared by vacuum cathodic vacuum arc (FCVA) method. Raman spectra and electron energy loss spectroscopy The structure of the film was analyzed and the trend of hardness and internal stress was analyzed. The results show that with the decrease of the film thickness, the G peak of the Gaussian decomposition of visible Raman spectroscopy moves to the lower wavenumber direction, and the ratio Id / Ig of the D peak and the G peak increases continuously. The G peak area and D peak area Which is smaller than that of Ag / Ad. It indicates that as the thickness of the film decreases, the content of sp3 bond in the DLC film decreases and the number of ordered sp2 clusters increases. The results of the electron energy loss spectroscopy also show that the decrease of the film thickness leads to the decrease of the sp3 bond content in the film. The film hardness decreases from 53.85 GPa to 39.64 GPa and the internal stress decreases from 4.63 GPa to 3.47 GPa when the thickness of the film changes from 50 nm to 30 nm. The hardness and internal stress decrease with the decrease of the thickness.