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汽车用的比通用的混合集成电路使用条件远为严酷。COMPACT 混合集成电路对于温度循环等的要求,较过去的“复盖式”有所提高。今后,在选用大规模集成电路方面,尚有不少问题有待解决。
Cars are far harsher than universal hybrid ICs. COMPACT hybrid integrated circuits for temperature cycling and other requirements than the past, “covered” has improved. In the future, there are still many problems to be solved in the selection of large-scale integrated circuits.