The three-layered (W-60 vol％Cu/W-40 vol％ Cu/W-20 vol％Cu) W/Cu functionally graded material (FGM) containing a Cu network structure was fabricated at different temperatures by hot-pressed sintering produced from copper-coated tungsten powders.The effects of various sintering temperatures on relative density,microstructure,thermal conductivity,hardness and flexural strength were investigated.Scanning electron microscopy (SEM) and X-ray diffraction (XRD) analysis show that a Cu network extends throughout the W/Cu FGM specimens sintered at 1065 ℃ and the graded structure can be retained perfectly,and W particles are distributed homogeneously.The low-temperature sintering densification of W/Cu FGM arises because the sintering mode of the cop per-coated tungsten particles includes just sintering Cu to Cu,rather than Cu to W,Cu to Cu and W to W,as required for conventional powder particles.The relative density of W/Cu FGM sintered at 1065 ℃ for 3 h under a load of 25 MPa is 96.1％.The thermal conductivity is up to 204 W·m-1.K-1 at normal temperature and 150 W.m-1·K-1 at 800 ℃.And the Vickers hardness varies with the gradient of different layers from 3.34 to 4.05 GPa.