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快捷半导体公司 (ＦａｉｒｃｈｉｌｄＳｅｍｉｃｏｎｄｕｃｔｏｒＩｎ ｔｅｒｎａｔｉｏｎａｌ)宣布推出用于ＴｉｎｙＬｏｇｉｃＴＭ 产品线的ＭｉｃｒｏＰａｋＴＭ 封装。最新封装技术使得缩小体积、节省空间这一目标进一步实现。新ＭｉｃｒｏＰａｋ的占位面积为 1.4 5ｍｍ×1
Fairchild Semiconductor International announces the MicroPakTM package for the TinyLogicTM product line. The latest packaging technology makes it possible to further reduce the size and space savings. The new MicroPak has a footprint of 1.4 mm x 1