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用TPR和TPO方法考察了载体TiO_2和金属Pd对CuO还原和再氧化行为的影响。发现TiO_2可显著降低CuO的还原和再氧化温度,担载Pd后,TiO_2上CuO甚至在十分温和条件下就能与H_2很快反应。文中就TiO_2和Pd的作用机理进行了讨论。
The effects of TiO 2 and Pd on the reduction and reoxidation of CuO were investigated by TPR and TPO methods. It is found that TiO 2 can significantly reduce the reduction and reoxidation temperature of CuO. After loading Pd, CuO on TiO 2 can react with H 2 even under very mild conditions. The mechanism of action of TiO_2 and Pd is discussed in this paper.