本文叙述了化学镀铜溶液的自动分析装置和自动控制方法。采用自动控制装置可以使化学镀铜液的成份维持恒定。自动分析与自动控制系统包括有:以一定的速率从镀槽中连续取出试样,然后自动进行分析化学镀铜液中的铜离子、氢氧根离子以及甲醛的浓度,并根据消耗的量自动进行补加,因而可以使化学镀铜液始终处于最佳状态,保证沉积出高质量的化学镀铜层。另外由于进行了溶液的自动分析补加,防止了化学镀铜液在使用过程中比例失调现象,可使镀液长期使用,显著减少了废液排放对环境污染的问题。 This article describes the automatic analysis of electroless copper plating solution and automatic control methods. The use of automatic control device can make the chemical composition of copper plating fluid to maintain a constant. Automatic analysis and automatic control system includes: a certain rate from the plating tank continuous removal of the sample, and then automatically analyze the electroless copper plating solution of copper ions, hydroxide ions and formaldehyde concentrations, and according to consumption of automatic For additional, which can make the electroless copper plating solution is always in the best condition, to ensure the deposition of high quality electroless copper plating. In addition, as a result of automatic analysis of the solution to add to prevent the electroless copper plating process imbalance in the use of the phenomenon can be long-term use of the bath, significantly reducing the discharge of waste on the issue of environmental pollution.