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和一年前一样,一九八六年半导体工业继续陷于不景气之中,八七年的前景如何,现在还不十分明朗,但总的发展趋势不会有大的改观。 作为半导体尖端技术开发和生产技术实用化的前哨战,技术上首先碰到的是微细加工问题,其典型器件就是DRAM。这种格局还将长期地延续下去。目前仍使用硅材料的DRAM,其高集成化的速度一如既往,还将以每三年四倍的增长率发展下去,与之同步前进的微细加工技术目前已达到用1微米设计线宽制做
As in a year ago, the semiconductor industry in 1986 continued to be in a downturn. It is still not yet clear what the prospects for the year 1987 will be. However, there will be no major change in the general trend of development. As the semiconductor cutting-edge technology development and production technology of the Sentinel warfare, technically encountered the first micro-processing issues, the typical device is DRAM. This pattern will continue in the long run. Currently using silicon DRAM, its high integration speed, as always, will also quadruple every three years, the rate of growth continues with the progress of the micro-processing technology has now reached 1 micron line width design